Description
As an Application Engineer (Failure Analysis), you will be a primary operator of the novel quantum diamond microscopy tools developed at QuantumDiamonds. You will work hands-on with a continuous stream of customer samples from major chip companies- either shipped to our lab or brought in during on-site visits- to demonstrate the device capabilities in real-world failure analysis scenarios.
Your day-to-day will include running measurements, preparing clear and professional customer reports, and contributing to application notes that highlight how our technology solves critical semiconductor challenges. As the main user of the device, your operational feedback will help shape product improvements as well.
If you have a strong background in semiconductor testing, using methods such as Photo-Emission Microscopy, Lock-in Thermography, OBIRCH, and SEM-based techniques (VC, EBAC, EBIRCH) we want to hear from you.
Who we are
Founded in 2022 as a spin-off of TU Munich, QD leverages quantum sensors to rapidly capture three-dimensional current maps within multi-layer chips. Our 30-strong team of physicists, engineers, and data scientists works side by side with major semiconductor manufacturers, helping them in chip debugging and accelerating their yield analysis. Backed by top-tier deep tech investors, semiconductor experts, and strategic public programs, we have ensured long-term stability, shifting from breakthrough to scale - and shaping the next chapter in chip testing.